Less dense foam formula for the application of cleaner waxes and light polishes. This pad has very light cutting power so it's perfect for the removal of light defects and micro marring.
Less dense foam formula for the application of cleaner waxes and light polishes. This pad has very light cutting power so it's perfect for the removal of light defects and micro marring.
6.5 inch...
Less dense foam formula for the application of cleaner waxes and light polishes. This pad has very light cutting power so it's perfect for the removal of light defects and micro marring.
Firm, medium density foam for scratch and defect removal. Use this pad with polishes and swirl removers. It's an all around pad that will work on most light to moderate imperfections.
Use with a 6...
Composition is firm enough to withstand added pressure during final finishing to remove buffer swirls. It has very little cut and will apply thin, even coats of waxes, sealants, and glazes, and ultra...
Composition is firm enough to withstand added pressure during final finishing to remove buffer swirls. It has very little cut and will apply thin, even coats of waxes, sealants, and glazes, and ultra...
